Organic light emitting diode display and method of manufacturing the same

ABSTRACT

An organic light emitting diode (OLED) display and a method of manufacturing the same are provided. The OLED display includes: a display panel assembly including a first substrate having a display area and a mounting area, a second substrate coupled to the display area of the first substrate, and an integrated circuit chip mounted in the mounting area of the first substrate; a cover window disposed opposite the second substrate and the integrated circuit chip and covering the display panel assembly; and an adhesive layer which fills up a space between the second substrate and the cover window, and a space between the mounting area of the first substrate and the cover window.

CLAIM OF PRIORITY

This application makes reference to, incorporates the same herein, andclaims all benefits accruing under 35 U.S.C. §119 from an applicationearlier filed in the Korean Intellectual Property Office on the 29^(th)of June 2008 and there duly assigned Serial No. 10-2008-0061125.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an organic light emitting diode (OLED)display and a method of manufacturing the same. More particularly, thepresent invention relates to an OLED display and a method ofmanufacturing the same in which stability and reliability of a displaypanel assembly are improved.

2. Description of the Related Art

An organic light emitting diode (OLED) display includes a plurality oforganic light emitting diodes having a hole injection electrode, anorganic emission layer, and an electron injection electrode. The OLEDdisplay emits light by energy which is generated when excitons, whichare generated when electrons and holes are coupled within the organicemission layer, fall from an exited state to a ground state, therebyforming an image.

Therefore, because the OLED display (unlike a liquid crystal display(LCD)) has self-luminance characteristics and does not require aseparate light source, the thickness and weight thereof can be reduced.Furthermore, because the OLED display represents high qualitycharacteristics, such as low power consumption, high luminance and ahigh reaction speed, the OLED display has been in the spotlight as thenext generation display device for portable electronic devices.

In general, the OLED display includes a display panel assembly in whichthe organic light emitting diodes are formed and a printed circuit board(PCB) which is electrically connected to the display panel assemblythrough a flexible printed circuit board (FPCB). Furthermore, the OLEDdisplay also includes a support member for supplementing mechanicalstrength and stability of the display panel assembly by coupling to thedisplay panel assembly, and a cover window for covering one surface ofthe display panel assembly which displays an image.

In the display panel assembly, the cover window is generally disposedseparate by a predetermined separation space from the display panelassembly. Light which is emitted from the display panel assembly isemitted to the outside via the separation space and the cover window.Therefore, there is a problem in that visibility of an image which isdisplayed by the OLED display is deteriorated due to a difference inrefractive indexes of the cover window and the separation space,deterioration of a refractive index due to the separation space, andreflection of light occurring in the cover window and a display panelassembly surface.

Furthermore, there is a problem in that an entire thickness of the OLEDdisplay becomes large due to the separation space between the coverwindow and the display panel assembly.

The above information disclosed in this section is provided only forenhancement of an understanding of the background of the invention, andtherefore it may contain information that does not form the prior artwhich is already known to a person of ordinary skill in the art.

SUMMARY OF THE INVENTION

The present invention has been developed in an effort to provide anorganic light emitting diode (OLED) display and a method ofmanufacturing the same having the advantages of improved stability andreliability of a display panel assembly.

The present invention has also been developed in an effort to provide anOLED display and a method of manufacturing the same having theadvantages of stably covering an integrated circuit chip in a displaypanel assembly, and stably coupling a cover window and the display panelassembly.

The present invention has been developed in an effort to further providean OLED display and a method of manufacturing the same having theadvantage of minimizing an entire thickness thereof.

The present invention has also been developed in an effort to provide anOLED display and a method of manufacturing the same having the advantageof improved productivity.

An exemplary embodiment of the present invention provides an OLEDdisplay which includes: a display panel assembly including a firstsubstrate having a display area and a mounting area, a second substratecoupled to the display area of the first substrate, and an integratedcircuit chip mounted in the mounting area of the first substrate; acover window disposed opposite to the second substrate and theintegrated circuit chip, and covering the display panel assembly; and anadhesive layer which fills up a space between the second substrate andthe cover window and a space between the mounting area of the firstsubstrate and the cover window.

The adhesive layer may include an acryl-based resin and cover theintegrated circuit chip.

The cover window may be transparent.

The cover window may include a light transmitting portion correspondingto a central portion of the display area and a light blocking portioncorresponding to an edge of the display area and the mounting area.

The OLED display may further include a support member which receives andsupports the display panel assembly, and the support member may includea bottom portion which is formed in parallel with the first substrateand a side wall which extends from the bottom portion and whichsurrounds side surfaces of the first substrate and the second substrate.

The side wall may be formed apart by a predetermined distance from edgesof the first substrate and the second substrate, and the adhesive layermay be formed by filling up a space between the side wall and edges ofthe first substrate and the second substrate.

The predetermined distance may be greater than 200 μm.

Another embodiment of the present invention provides a method ofmanufacturing an OLED display, including: providing a display panelassembly which includes a first substrate having a display area and amounting area, a second substrate coupled to the display area of thefirst substrate, and an integrated circuit chip mounted in the mountingarea of the first substrate; providing a cover window; providing anadhesive material on one surface of the cover window; coupling the coverwindow to the display panel assembly so that one surface of the coverwindow, in which the adhesive material is provided, is opposite thesecond substrate and the integrated circuit chip; diffusing the adhesivematerial to fill up a space between the second substrate and the coverwindow and a space between the mounting area of the first substrate andthe cover window; and forming an adhesive layer by curing the adhesivematerial.

The adhesive material may include an acryl-based resin, and the adhesivelayer may be formed by cuing the adhesive material through radiatingultraviolet rays (UV) or applying heat to the adhesive material.

The method may further include allowing a part of an adhesive materialwhich is provided on the cover window to flow and to contact a part ofthe display panel assembly, and then coupling the cover window and thedisplay panel assembly.

The method may further include receiving the display panel assembly in asupport member, wherein the support member includes a bottom portionformed in parallel with the first substrate and a side wall whichextends from the bottom portion and which surrounds side surfaces of thefirst substrate and the second substrate, and wherein the side wall maybe disposed apart by a predetermined distance from edges of the firstsubstrate and the second substrate.

The adhesive material may be filled and cured in the space between theside wall and the edges of the first substrate and the second substrate,and may form the adhesive layer.

The predetermined distance may be greater than 200 μm.

According to the present invention, the OLED display can have a displaypanel assembly having improved stability and reliability.

Furthermore, the OLED display can have a cover window and a displaypanel assembly which are stably coupled to each other, and an integratedcircuit chip which is stably covered by the cover window.

Furthermore, the entire thickness of the OLED display can be minimized.

In addition, productivity of the OLED display can be improved.

Moreover, the OLED display can be effectively manufactured.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the present invention, and many of theattendant advantages thereof, will be readily apparent as the presentinvention becomes better understood by reference to the followingdetailed description when considered in conjunction with theaccompanying drawings in which like reference symbols indicate the sameor similar components, wherein:

FIG. 1 is an exploded perspective view of an organic light emittingdiode (OLED) display according to an exemplary embodiment of the presentinvention.

FIG. 2 is a top plan view illustrating a coupled state of the OLEDdisplay of FIG. 1.

FIG. 3 is a cross-sectional view of the OLED taken along line III-III ofFIG. 2.

FIG. 4 is a cross-sectional view of the OLED taken along line IV-IV ofFIG. 2.

FIG. 5 is a diagram of a pixel circuit of a display panel assembly shownin FIG. 1.

FIG. 6 is a partially-enlarged view of the display panel assembly shownin FIG. 1.

FIGS. 7 thru 9 are cross-sectional views sequentially illustrating amethod of manufacturing the OLED display of FIG. 1.

DETAILED DESCRIPTION OF THE INVENTION

The present invention will be described more fully hereinafter withreference to the accompanying drawings, in which exemplary embodimentsof the invention are shown. The present invention is not limited to theexemplary embodiments, but may be embodied in various forms.

Furthermore, because the size and thickness of each element displayed inthe drawings are randomly displayed for better understanding and ease ofdescription, the present invention is not limited thereto.

Accordingly, the drawings and description are to be regarded asillustrative in nature and not restrictive. Like reference numeralsdesignate like elements throughout the specification.

In addition, in the drawings, the thickness of layers, films, panels,regions, etc., are exaggerated for clarity. Like reference numeralsdesignate like elements throughout the specification. It will beunderstood that, when an element such as a layer, film, region orsubstrate is referred to as being “on” another element, it can bedirectly on the other element or intervening elements may also bepresent. In contrast, when an element is referred to as being “directlyon” another element, there are no intervening elements present.

FIG. 1 is an exploded perspective view of an organic light emittingdiode (OLED) display according to an exemplary embodiment of the presentinvention, FIG. 2 is a top plan view illustrating a coupled state of theOLED display of FIG. 1, FIG. 3 is a cross-sectional view of the OLEDtaken along line III-III of FIG. 2, and FIG. 4 is a cross-sectional viewof the OLED taken along line IV-IV of FIG. 2.

As shown in FIGS. 1 and 2, the OLED display 100 includes a display panelassembly 50, a cover window 10, and an adhesive layer 20. The OLEDdisplay 100 further includes a support member 70, a PCB 30, and an FPCB35.

The display panel assembly 50 includes a first substrate 51, a secondsubstrate 52, and an integrated circuit chip 40. The first substrate 51has a display area DA and a mounting area NA. The second substrate 52has a size smaller than that of the first substrate 51, and is attachedto the display area DA of the first substrate 51. The first substrate 51and the second substrate 52 are coupled by a sealant (not shown)disposed along an edge of the second substrate 52. The integratedcircuit chip 40 is mounted in the mounting area NA of the firstsubstrate 51. In this case, the integrated circuit chip 40 is mounted ona surface having a direction equal to that of an attaching surface ofthe second substrate 52 in the first substrate 51. The second substrate52 and the integrated circuit chip 40 are adjacently disposed.

The first substrate 51 includes pixels (shown in FIGS. 5 and 6) disposedin a matrix form in the display area DA. The first substrate 51 furtherincludes a scan driver (not shown) and a data driver (not shown)disposed in the display area DA or the mounting area NA to drive pixels.The first substrate 51 further includes pad electrodes (not shown)disposed in the mounting area NA. The integrated circuit chip 40 ismounted in the mounting area NA of the first electrode 51 so as to beelectrically connected to the pad electrode (not shown). The firstsubstrate 51 further includes a wire (not shown) for connecting theintegrated circuit chip 40, the scan driver (not shown), and the datadriver (not shown).

The second substrate 52 is bonded to the first substrate 51 so as toseal up and protect pixels, circuits, and wires formed in the firstsubstrate 51 from the outside. The display panel assembly 50 furtherincludes a polarizing plate 58 (shown in FIG. 3) attached to one surfaceof the second substrate 52 for suppressing reflection of external light.However, the polarizing plate 58 is not always necessary and may beomitted.

The integrated circuit chip 40 is mounted in the mounting area NA(FIG. 1) of the first substrate 51 using a chip on glass (COG) method.

The support member 70 receives and supports the display panel assembly50. The support member 70 includes a bottom portion 71 and a side wall72. The bottom portion 71 is formed in parallel with the first substrate51 of the display panel assembly 50. That is, the display panel assembly50 is received in the support member 70 so that the first substrate 51maybe seated in the bottom portion 71. The side wall 72 is extended andprotrudes from the bottom portion 71 so as to surround side surfaces ofthe first substrate 51 and the second substrate 52. In this case, theside wall 72 is formed apart by a predetermined separation distance GBfrom edges of the first substrate 51 and the second substrate 52. It ispreferable that the predetermined separation distance GB be greater than200 μm, and a reason thereof is described later.

The support member 70 has an opening 725 formed in a part of the sidewall 72 adjacent to the mounting area NA of the first substrate 51 sothat the FPCB 35 may be connected to the mounting area NA of the firstsubstrate 51.

The support member 70 may be formed using various methods and withseveral materials. As an example, the support member 70 maybe made of amaterial having high rigidity, i.e., a metal material such as stainlesssteel, cold rolling steel, aluminum, aluminum alloy, nickel alloy,magnesium, and magnesium alloy. The support member 70 having the bottomportion 71 and the side wall 72 may be formed by molding a metal platemade of such a metal material by a well-known deep drawing process orbending process. When molded by a deep drawing process, corners of theside wall 72 can be connected without a joint.

The PCB 30 includes electronic elements (not shown) for processing adriving signal and a connector 36 for receiving an external signal. Oneside of the FPCB 35 is connected to the mounting area NA of the firstsubstrate 51 and the other side thereof is connected to the PCB 30. Thatis, the FPCB 35 electrically connects the PCB 30 and the display panelassembly 50. Therefore, a driving signal generated in the PCB 30 istransferred to an integrated circuit chip 40 or a driver (not shown) ofthe first substrate 51 through the FPCB 35.

As shown in FIG. 3, the FPCB 35 is bent and the printed circuit boardPCB 30 is disposed on a rear surface of the support member 70.

The cover window 10 (FIG. 1) is disposed opposite the second substrate52 and the integrated circuit chip 40, and entirely covers the displaypanel assembly 50. Specifically, the cover window 10 covers one surfaceof the display panel assembly 50 in an image display direction. Thecover window 10 may be made of a transparent material, such as glass orplastic.

Furthermore, as shown in FIG. 3, the cover window 10 includes a lightblocking portion BA corresponding to an edge of the display panelassembly 50 including the mounting area NA of the first substrate 51,and a light transmitting portion TA corresponding to a central portionof the display panel assembly 50. That is, the light blocking portion BAcorresponds to an edge of the display area DA and the mounting area NA,and the light transmitting portion TA corresponds to a central portionof the display area DA. The light blocking portion BA performs thefunctions of blocking unnecessary light and covering a portion whichdoes not display an image in the display panel assembly 50.

However, the present invention is not limited thereto. Therefore, thecover window 10 may be entirely transparent and formed without the lightblocking portion BA. In this case, the OLED display 100 may furtherinclude a separate light blocking member.

The adhesive layer 20 may be made of a material including an acryl-basedresin which is cured by ultraviolet (UV) or heat. Furthermore, theadhesive layer 20 has relatively higher elasticity than that of thecover window 10 and the support member 70.

As shown in FIGS. 1, 3 and 4, the adhesive layer 20 fills up a spacebetween the second substrate 52 and the cover window 10 and a spacebetween the mounting area NA of the first substrate 51 and the coverwindow 10. Furthermore, the adhesive layer 20 fills up a space betweenthe side wall 72 of the support member 70 and edges of the firstsubstrate 51 and the second substrate 52.

In this way, the adhesive layer 20 couples the cover window 10 and thedisplay panel assembly 50 by filling up a space between the displaypanel assembly 50 and the cover window 10, and couples the supportmember 70 and the display panel assembly 50, and the support member 70and the cover window 10, by filling up a space between the edge of thedisplay panel assembly 50 and the side wall 72 of the support member 70.

Furthermore, the adhesive layer 20 fully covers and protects themounting area NA of the first substrate 51 including the integratedcircuit chip 40. That is, the adhesive layer 20 suppresses corrosion ofthe mounting area NA while mechanically protecting the integratedcircuit chip 40. Accordingly, the display panel assembly 50 may renderunnecessary a separate protective layer for protecting a circuit, awire, and a pad formed in the mounting area NA of the first substrate51.

Because the adhesive layer 20 prevents unnecessary separation of thedisplay panel assembly 50 from the support member 70 and the coverwindow 10, and has relatively excellent elasticity, the adhesive layer20 protects the display panel assembly 50, thereby improving mechanicalstability and reliability of the OLED display 100. That is, the adhesivelayer 20 protects the display panel assembly 50 from external impact.Accordingly, the OLED display 100 may render unnecessary a separatereinforcement for protecting the display panel assembly 50.

Furthermore, the adhesive layer 20 suppresses penetration of moistureinto the display panel assembly 50, thereby improving environmentalstability and reliability.

As described above, the adhesive layer 20 should be able to have aminimum thickness for preventing separation of elements and protectingthe display panel assembly 50 from an external impact. Therefore, it ispreferable to secure a separation distance GB between the side wall 72of the support member 70 and the edge of the display panel assembly 50to be greater than 200 μm in order to secure a minimum space in whichthe adhesive layer 20 is to be formed so that the adhesive layer 20 mayhave enough thickness.

Furthermore, it is preferable that a refractive index of the adhesivelayer 20 be similar to that of the cover window 10. This is because theadhesive layer 20 fills up a space between the second substrate 52 andthe cover window 10, and thus, when refractive indexes of the adhesivelayer 20 and the cover window 10 become similar, reflection of light dueto a difference in refractive indexes can be minimized. Because therefractive index of an acryl-based resin used as a material of theadhesive layer 20 is relatively more similar to that of the cover window10 than air, and since the adhesive layer 10 fills up a space betweenthe second substrate 52 and the cover window 10, reflection of light dueto a difference between the refractive indexes can be effectivelyreduced.

In addition, as described above, because the OLED display 100 may renderunnecessary a separate reinforcement for improving mechanical andenvironmental stability of a separate protective layer and the panelassembly 50 for protecting the integrated circuit chip 40, etc.,productivity thereof can be improved.

By such a configuration, the OLED display 100 can have a display panelassembly 50 having improved stability and reliability.

That is, the display panel assembly 50, the cover window 10 and thesupport member 70 are stably coupled by the adhesive layer 20, and themounting area NA of the first substrate 51 including the integratedcircuit chip 40 is stably covered by the adhesive layer 20. Furthermore,an external impact applied to the display panel assembly 50 can beabsorbed by the adhesive layer 20.

Because the cover window 10 is effectively fixed by the adhesive layer20, an entire thickness of the OLED display 100 can be minimized.

Referring to FIGS. 5 and 6, an internal structure of the display panelassembly 50 will be described hereinafter.

The display panel assembly 50 has a plurality of pixels and displays animage. As shown in FIGS. 5 and 6, the pixel includes an organic lightemitting diode L1 and driving circuits T1, T2, and C1. The pixel isgenerally formed in the first substrate 51. That is, the first substrate51 includes a substrate member 511, and the driving circuits T1, T2 andC1 and the organic light emitting diode L1 which are formed on thesubstrate member 511.

The organic light emitting diode L1 includes an anode 544, an organicemission layer 545, and a cathode 546. The driving circuits include atleast two thin film transistors T1 and T2 and at least one storagecapacitor C1. The thin film transistor basically includes a switchingtransistor T1 and a driving transistor T2.

The switching transistor T1 is connected to a scan line SL1 and a dataline DL1, and transmits a data voltage which is inputted to the dataline DL1 to the driving transistor T2 according to a switching voltagewhich is inputted to the scan line SL1. The storage capacitor C1 isconnected to the switching transistor T1 and a power source line VDD,and stores a voltage corresponding to a difference between a voltagereceived from the switching transistor T1 and a voltage supplied to thepower source line VDD.

The driving transistor T2 is connected to the power source line VDD andthe storage capacitor C1 so as to supply an output current IOELD, whichis proportional to a square of a difference between a voltage stored inthe storage capacitor C1 and a threshold voltage, to the organic lightemitting diode L1, and the organic light emitting diode L1 emits lightby the output current IOLED. The driving transistor T2 includes a sourceelectrode 533, a drain electrode 532, and a gate electrode 531, and theanode 544 of the organic light emitting diode L1 is connected to thedrain electrode 532 of the driving transistor T2. The configuration ofthe pixel is not limited to the above-described example, and can bevariously changed.

The second substrate 52 covers the first substrate 51 in which theorganic light emitting diode L1 and the driving circuits T1, T2, and C1are formed.

Referring to FIGS. 7 thru 9, a method of manufacturing the OLED display100 of FIG. 1 is described hereinafter.

First, after the display panel assembly 50 is provided, the displaypanel assembly 50 is received in the support member 70 (see FIG. 1). Adetailed structure of the display panel assembly 50 and the supportmember 70 has already been described.

Next, as shown in FIG. 7, after the cover window 10 is provided and anecessary quantity of the adhesive material 25 is determined, theadhesive material 25 is coated on one surface of the cover window 10. InFIG. 7, the cover window 10 includes the light blocking portion BA andthe light transmitting portion TA, but the present invention is notlimited thereto. Therefore, the cover window 10 may be entirelytransparent.

Next, as shown in FIG. 8, the cover window 10 is coupled to the displaypanel assembly 50 so that one surface of the cover window 10, in whichthe adhesive material 25 is provided, may be opposite the secondsubstrate 52 and the integrated circuit chip 40. In this case, the lightblocking portion BA of the cover window 10 is disposed so as tocorrespond to each of the mounting area NA (shown in FIG. 1) of thefirst substrate 10 and an edge of the second substrate 52.

Furthermore, as shown in FIG. 8, the cover window 10 and the displaypanel assembly 50 are not directly coupled to each other, a part of theadhesive material 25 coated on the cover window 10 is flown and contactsthe display panel assembly 50, and then the cover window 10 and thedisplay panel assembly 50 are coupled to each other.

When the cover window 10 and the display panel assembly 50 are coupledusing such a method, a bubble can be prevented from being generated inan interface of the adhesive material 25 and the display panel assembly50.

Next, by pressurizing the cover window 10, the adhesive material 25 isdiffused so as to fill up the space between the second substrate 52 andthe cover window 10, the space between the mounting area NA of the firstsubstrate 51 and the cover window 10, and the space between the sidewall 72 of the support member 70 and an edge of the display panelassembly 50.

Next, as shown in FIG. 9, the adhesive layer 20 is completed by curingthe adhesive material 25. In this case, the adhesive material 25 cancompletely be cured through two curing processes. The two curingprocesses include a preliminary curing process and a curing process. Thepreliminary curing process is performed using ultraviolet (UV), and thecuring process is performed using UV or heat.

Furthermore, as shown in FIG. 9, UV rays are radiated onto the adhesivematerial 25 via the cover window 10, but the present invention is notlimited thereto. Therefore, UV rays may be radiated in variousdirections in consideration of the structure of the support member 70and the cover window 10. When UV rays are radiated in a sidewisedirection of the display panel assembly 50, UV rays may be radiated witha moving method using an optical fiber.

The OLED display 100 having improved stability and reliability ismanufactured using such a manufacturing method.

That is, the display panel assembly 50, the cover window 10 and thesupport member 70 are stably coupled by the adhesive layer 20, and themounting area NA of the first substrate 51 including the integratedcircuit chip 40 is stably covered by the adhesive layer 20. Furthermore,an external impact applied to the display panel assembly 50 can beabsorbed by the adhesive layer 20.

In addition, because the cover window 10 is effectively fixed by theadhesive layer 20, an entire thickness of the OLED display 100 can beminimized.

Moreover, by shortening the manufacturing process, productivity can beimproved.

Referring to Table 1 below, optical characteristics of an exemplaryembodiment according to the present invention and a Comparative Exampleare described hereinafter. In the display area DA, the space between thecover window 10 and the display panel assembly 50 is filled with anadhesive layer which is entirely made of a polymer material, such asacryl-based resin, in the exemplary embodiment, and is filled with airin the Comparative Example.

TABLE 1 Comparative Experimental Example Example luminance [cd/m²] 180206 contrast ratio of external light 1.74 2.45 @ 10,000 luxrepresentation of external light color  5.3% 14.5% @ 10,000transmittance of cover window [%] 91.8% 91.8% reflection ratio of coverwindow and 7.44% 4.35% display panel assembly [%]

As shown in Table 1, the exemplary embodiment has excellent opticalcharacteristics compared to those of the Comparative Example.

While this invention has been described in connection with what ispresently considered to be practical exemplary embodiments, it is to beunderstood that the invention is not limited to the disclosedembodiments, but, on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims.

1. An organic light emitting diode (OLED) display, comprising: a displaypanel assembly comprising a first substrate having a display area and amounting area, a second substrate coupled to the display area of thefirst substrate, and an integrated circuit chip mounted in the mountingarea of the first substrate; a cover window disposed opposite the secondsubstrate and the integrated circuit chip, and covering the displaypanel assembly; and an adhesive layer which fills a space between thesecond substrate and the cover window, and a space between the mountingarea of the first substrate and the cover window.
 2. The OLED display ofclaim 1, wherein the adhesive layer comprises an acryl-based resin andcovers the integrated circuit chip.
 3. The OLED display of claim 1,wherein the cover window is transparent.
 4. The OLED display of claim 1,wherein the cover window comprises a light transmitting portioncorresponding to a central portion of the display area and a lightblocking portion corresponding to an edge of the display area and themounting area.
 5. The OLED display of claim 1, further comprising asupport member which receives and supports the display panel assembly;and wherein the support member comprises a bottom portion formed inparallel with the first substrate, and a side wall which extends fromthe bottom portion and which surrounds side surfaces of the firstsubstrate and the second substrate.
 6. The OLED display of claim 5,wherein the side wall is formed apart by a predetermined distance fromedges of the first substrate and the second substrate; and wherein theadhesive layer is formed by filling up a space between the side wall andedges of the first substrate and the second substrate.
 7. The OLEDdisplay of claim 6, wherein the predetermined distance is greater than200 μm.
 8. A method of manufacturing an organic light emitting diode(OLED) display, comprising the steps of: providing a display panelassembly which includes a first substrate having a display area and amounting area, a second substrate coupled to the display area of thefirst substrate, and an integrated circuit chip mounted in the mountingarea of the first substrate; providing a cover window; providing anadhesive material on one surface of the cover window; coupling the coverwindow to the display panel assembly so that said one surface of thecover window on which the adhesive material is provided is opposite thesecond substrate and the integrated circuit chip; diffusing the adhesivematerial so as to fill up a space between the second substrate and thecover window and a space between the mounting area of the firstsubstrate and the cover window; and forming an adhesive layer by curingthe adhesive material.
 9. The method of claim 8, wherein the adhesivematerial includes an acryl-based resin, and the adhesion layer is formedby curing the adhesive material through one of radiating ultraviolet(UV) rays and applying heat to the adhesive material.
 10. The method ofclaim 8, further comprising the steps of allowing a part of the adhesivematerial provided on the cover window to flow and to contact a part ofthe display panel assembly, and then coupling the cover window and thedisplay panel assembly.
 11. The method of claim 8, further comprisingthe steps of: receiving the display panel assembly in a support member;providing the support member with a bottom portion formed in parallelwith the first substrate, and a side wall which extends from the bottomportion and which surrounds side surfaces of the first substrate and thesecond substrate; and disposing the side wall apart by a predetermineddistance from edges of the first substrate and the second substrate. 12.The method of claim 11, wherein the step of forming the adhesive layercomprises filling and curing the adhesive material in a space betweenthe side wall and the edges of the first substrate and the secondsubstrate.
 13. The method of claim 11, wherein the predetermineddistance is greater than 200 μm.